PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD3L SOT-23 0502Matte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0083
MCP100T-315I/TT |
RFQ for MCP100T-315I/TT |
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| Technical/Catalog Information | MCP100T-315I/TT |
| Vendor | Microchip Technology (VA) |
| Category | Integrated Circuits (ICs) |
| Output | Push-Pull, Totem Pole |
| Reset | Active Low |
| Package / Case | SOT-23-3, TO-236-3 |
| Packaging | Cut Tape (CT) |
| Number of Voltages Monitored | 1 |
| Reset Timeout | 150 ms Minimum |
| Type | Simple Reset/Power-On Reset |
| Voltage - Threshold | 3.15V |
| Operating Temperature | -40°C ~ 85°C |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MCP100T 315I TT MCP100T315ITT MCP100T 315I TTCT ND MCP100T315ITTCTND MCP100T-315I/TTCT |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP100T-315I/TT | - | - | - |